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Tescom 23 Series

TESCOM™ 23 Series ultra-high purity inline regulator offers 5 Ra & 10 Ra microinch finishes with high flow capabilities to 950 SLPM. The tied diaphragm 23 Series provides an internally springless & threadless design with inlet pressure of 250 PSIG [17.2 bar] and outlet pressure up to 100 PSIG [6.9 bar]. Ideal for use in purging applications.

Tescom 64-2600 Series

TESCOM™ 64-2600 Series economical ultra-high purity pressure reducing regulator provides stainless steel construction with 10 Ra surface finish and is electronic grade cleaned. Inlet pressures are 600 or 3500 PSIG [41.3 or 241 bar] with outlet pressures of up to 250 PSIG [17.2 bar]. Ideal for use in 1/4″ point-of-use, gas cabinets, semiconductor manufacturing, valve manifold boxes and research labs.

Tescom 64-2800 Series

TESCOM™ 64-2600 Series economical ultra-high purity pressure reducing regulator provides stainless steel construction with 10 Ra surface finish and is electronic grade cleaned. Inlet pressures are 600 or 3500 PSIG [41.3 or 241 bar] with outlet pressures of up to 250 PSIG [17.2 bar]. Ideal for use in 1/4″ point-of-use, gas cabinets, semiconductor manufacturing, valve manifold boxes and research labs.

Tescom 64-3200 Series

TESCOM™ 64-3200 Series ultra-high purity, high flow tied diaphragm pressure reducing regulator offers 10 Ra surface finish and is available in Hastelloy® trim. Maximum flow rates are up to 900 SLPM, with inlet pressures of 150, 1000, 1500 PSIG [10.3, 69, 103 bar] and outlet pressures up to 200 PSIG [13.8 bar]. Ideal for use in Bulk Specialty Gas Systems (BSGS), 1/2″ point-of-use, tool hook-ups and gas cabinets.

Tescom 64-3400 Series

TESCOM™ 64-3400 Series dual-stage, ultra high purity pressure reducing regulator offers a tied diaphragm design and 10 Ra surface finish with available Hastelloy® trim. Inlet pressure is 3500 PSIG [241 bar] with outlet pressures up to 150 PSIG [10.3 bar]. Ideal for use in gas cabinets, semiconductor manufacturing and research labs.

Tescom 64-3600 Series

TESCOM™ 64-3600 Series ultra high purity, highly sensitive pressure reducing regulator offers low droop, tied diaphragm design, 10 Ra surface finish with available Hastelloy® trim. Inlet pressures are 600 or 3500 PSIG [41.3 or 241 bar] with outlet pressure up to 150 PSIG [10.3 bar]. Ideal for use in 1/4″ point-of-use, gas cabinets, semiconductor manufacturing and valve manifold boxes.

Tescom 64-5000 Series

TESCOM™ 64-5000 Series ultra-high purity absolute/subatmospheric pressure reducing regulator offers a 10 Ra surface finish. Inlet pressures are 120, 600 or 3500 PSIG [8.3, 41.3, 241 bar] with outlet pressures ranges from 28″ Hg-15 to 100 PSIG [6.9 bar]. Ideal for use in vacuum pressures control, toxic gas analysis, valve manifold boxes, gas cabinets and semiconductor manufacturing.

Tescom 64-5400 Series

TESCOM™ 64-5400 Series ultra-high purity pressure reducing regulator provides 316 stainless steel with Electropolish, 10 Ra surface finish and Hastelloy® diaphragm design. The 64-5400 Series offers high flow Cv=1.0 and inlet pressure of 600 PSIG [41.3 bar] with outlet pressures up to 150 PSIG [10.3 bar]. Ideal for us in Bulk Specialty Gas Systems (BSGS), 1/2″ point-of-use, tool hook-ups and gas cabinets.

Tescom 74-2400 Series

TESCOM™ 74-2400 Series ultra-high purity tied diaphragm pressure reducing regulator provides low internal volume and an internally springless & threadless design. The 74-2400 Series offers 5 Ra or 10 Ra surface finishes and 316 stainless steel VAR. Inlet pressures are 600 or 3500 PSIG [41.3 or 241 bar] with outlet pressures up to 100 PSIG [6.9 bar]. Ideal for use in 1/4″ point-of-use, gas cabinets, semiconductor manufacturing, valve manifold boxes and research labs.

Tescom 74-3000 Series

TESCOM™ 74-3000 Series ultra-high purity pressure reducing regulator offers 5 Ra or 10 Ra surface finishes, high flow Cv= 0.5, and an internally threadless and low internal volume design. Inlet pressures are 600, 1000 or 3500 PSIG [41.3, 69, 241 bar] with outlet pressures up to 150 PSIG [10.3 bar]. Ideal for us in high flow purging systems, 1/2″ point-of-use, regulation of specialty gases and semiconductor manufacturing.